11.1 BQFP(quad flat package with bumper)
带缓冲垫的四侧引脚扁平封装。QFP封装之一,在封装本体的四个角设置突起(缓冲垫)以防止在运送过程中引脚发生弯曲变形。美国半导体厂家主要在微处理器和ASIC等电路中采用此封装。引脚中心距0.635mm,引脚数从84 到196左右。
11.2 QIC(quad in-line ceramic package)
TLE9180D-31QK
TLD2331-3EP
A4916KJPTR-T
S9KEAZN16AMLC
MMPF0100F0ANES
MMPF0100F0AEP
MC13892DJVL
SPC560P44L3CEFAR
SPC5743PK1AMLQ5R
SPC560P50L3CEFAR
IS45S32200L-7BLA2
VNN7NV04PTR-E
VN5E025AJTR-E
NCV2902DTBR2G
TPS74801QRGWRQ1
TPIC44L01DBR
TLE42754G
NCV47821PAAJR2G
TPS745125PQWDRBRQ1
S9S12GN32BMLCR
S9S12G192F0CLL
LM324IYPT
BUK9K35-60E
TPS40210QDGQRQ1
BZX384-C6V2
S912XDP512JMAL
A4935KJPT-T
UCC28C41QDRQ1
MCIMX6D6AVT08AD
AONR34332C
DMP4015SK3Q
PESD1CAN.125
S9S12G64AMLF
NCV8402ADDR2G
VNH7013XPTR-E
SKA-TC237LP-32F200NAC